STS ICP RIE at James Watt Nanofabrication Centre, University of Glasgow


w: http://www.jwnc.gla.ac.uk/etch.html

This is a high density plasma tool with load-lock mainly used for deep Si etching using the Bosch process. The tool is used for a range of MEMS, NEMS and silicon optoelectronic and nanoelectronic research. Gases: SF6, C4F8, N2, Ar, He, O2. Materials etched: Si and SOI (Bosch process, mixed process), Ge, SiGe.

Hosted by: James Watt Nanofabrication Centre, University of Glasgow.

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