The cleanroom has the essential equipment needed to create semiconductor devices like light emitters and receivers from novel wafer structures. Electrical connections are made with gold wires thinner than a human hair using wirebonders and other bonding techniques used by worldwide semiconductor manufacturers. The devices made in the facility may have etched features with dimensions smaller than a micrometre. Thin film contacts and waveguides for the devices are deposited by a vacuum coating system. The contact metals (gold and dopants like germanium, tin, magnesium and zinc) are annealed to make the ohmic and Schottky contacts needed for devices like MESFETs.