Karl-Suss MA6 double-sided mask aligner at Centre for Innovative Manufacturing in Photonics, University of Southampton


w: http://www.cimp.soton.ac.uk/integrated.html

Allows printing of structures on flat substrates by replication of a mask using photoresist exposure and development followed by etching, for example. Feature sizes below 1 micron may be replicated over wafers up to 100mm diameter. Double-sided aligning allows alignment of features on both sides of a silicon wafer.

Hosted by: Centre for Innovative Manufacturing in Photonics, University of Southampton.

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